Ansys (ANSS) recently announced a collaboration with Taiwan Semiconductor Manufacturing Company (“TSMC”) on the latter’s Compact Universal Photonic Engines (COUPE) platform. The collaboration aims to speed up chip-to-chip and machine-to-machine communication, thereby delivering a high-fidelity multiphysics solution of artificial intelligence (AI), datacenter, cloud, and high-performance computing (HPC) chips. COUPE is a sophisticated Silicon Photonics (SiPh) integration system and Co-Packaged Optics platfor ...