Ansys electro-thermal analysis tools address novel physics requirements for signoff verification of multi-chip HPC, graphics, and AI applications / Key Highlights Ansys collaboration to expand from single-die system-on-chip (SoC) to include Intel's embedded multi- die interconnect bridge (EMIB) assembly technology Ansys multiphysics analyses provide signoff verification of thermal integrity, power integrity, and mechanical reliability PITTSBURGH, Feb. 22, 2024 /PRNewswire/ -- Ansys (NASDAQ: ANSS) and Intel ...