New portfolio drives chip performance with panel-based interconnect innovation KLA is extending the capability of the proven Corus™ direct imaging platform and introducing the Serena™ direct imaging platform to support mainstream and advanced IC substrate lithography requirements New Lumina™ inspection and metrology systems further equip IC substrate (including glass core) and panel-based interposer makers to efficiently build advanced products with high quality and yield MILPITAS, Calif., Oct. 15, 2024 /PR ...