Ansys to demonstrate 3D multiphysics visualization of electromagnetic and thermal effects in semiconductor packages at Design Automation Conference / Key Highlights Existing Ansys capabilities with NVIDIA Omniverse platform supercharge 3D integrated circuit (3D-IC) design by enabling designers to optimize semiconductor chips within the context of a system-on-a-chip By transforming data into meaningful visual insights, the Ansys multiphysics platform empowers IC designers to interact with models of electroma ...