SAN JOSE, Calif., June 12, 2024 (GLOBE NEWSWIRE) -- Today, Adeia Inc. (NASDAQ:ADEA), a leading R&D and intellectual property (IP) licensing company known for bringing leading innovations in the semiconductor and media/entertainment technology sectors to market, announced recent developments in hybrid bonding a technology targeted toward the future of semiconductor packaging enabling high-performance computing capabilities, like those required for AI. The company has experienced encouraging continued interes ...