SANTA CLARA, Calif., Feb. 06, 2024 (GLOBE NEWSWIRE) -- Adeia Inc. (NASDAQ:ADEA), the company whose patented innovations enhance billions of devices, today announced that it is showcasing its hybrid bonding technology at the Chiplet Summit on February 6 through 8, 2024, at the Santa Clara Convention Center. Over the past 30 years, Adeia has pioneered fundamental advances in the semiconductor industry. With an extensive and growing portfolio of intellectual property covering hybrid bonding, advanced process n ...