EPIC Advanced Packaging marks an expansion of Applied’s global innovation platformCompany convenes top semiconductor R&D leaders to advance high-performance, low-power AI chip packaging technologies SANTA CLARA, Calif. and SINGAPORE, Nov. 18, 2024 (GLOBE NEWSWIRE) -- Applied Materials, Inc. today announced plans to expand its global EPIC* innovation platform with a new collaboration model specifically designed to accelerate commercialization of advanced chip packaging technologies. To kick-off the initiativ ...