Dublin, Sept. 06, 2024 (GLOBE NEWSWIRE) -- The "Hybrid Bonding - Patent Landscape Analysis 2024" report has been added to ResearchAndMarkets.com's offering. Hybrid bonding technology emerged in 2005 with the introduction of Ziptronix's direct bond interconnect (DBI) technology. In 2015, Tessera (now Adeia) acquired Ziptronix, and DBI technology entered the market in 2016 through Sony's CMOS image sensor (CIS) used in Samsung's Galaxy S7 mobile phone. Since then, hybrid bonding technology has been explored ...