International Business Machines Corporation (IBM) has unveiled the architecture of the upcoming IBM Telum II Processor and IBM Spyre at Hot Chips 2024. Designed to enhance processing capacity in next-generation IBM Z mainframe systems, these technologies will accelerate the use of traditional and large language AI models through an innovative ensemble artificial intelligence (AI) method.This advancement addresses the growing need for power-efficient, secure and scalable solutions as generative AI projects w ...