Veeco Announces Agreement with IBM to Explore Wet Processing System for Advanced Packaging Applications
IBM(IBM) GlobeNewswire News Room·2024-08-14 21:00
PLAINVIEW, N.Y., Aug. 14, 2024 (GLOBE NEWSWIRE) -- Veeco Instruments Inc. (NASDAQ: VECO) today announced that IBM selected the WaferStorm® Wet Processing System for Advanced Packaging applications and has entered into a joint development agreement to explore advanced packaging applications using multiple wet processing technologies from Veeco. Under the agreement, the Waferstorm Wet Processing System will be installed at facilities at the Albany NanoTech Complex in Albany, NY, where IBM and other ecosystem ...