DALLAS, July 16, 2024 /PRNewswire/ -- Texas Instruments (TI) (Nasdaq: TXN) today introduced six new power modules designed to improve power density, enhance efficiency and reduce EMI. These power modules leverage TI's proprietary MagPack integrated magnetic packaging technology, shrinking their size by up to 23% compared to competing modules, enabling designers of industrial, enterprise and communications applications to achieve previously impossible performance levels.  In fact, three of the six new device ...