Industry’s first use of ruthenium in high-volume production enables copper chip wiring to be scaled to the 2nm node and beyond and reduces resistance by as much as 25%New enhanced low-k dielectric material reduces chip capacitance and strengthens logic and DRAM chips for 3D stacking SANTA CLARA, Calif., July 08, 2024 (GLOBE NEWSWIRE) -- Applied Materials, Inc. today introduced materials engineering innovations designed to increase the performance-per-watt of computer systems by enabling copper wiring to sca ...